The AI hardware ecosystem is accelerating, with infrastructure innovations designed for speed, scalability, and efficiency.
Broadcom’s Jericho4 Elevates AI Networking
Broadcom’s recently unveiled Jericho4 chip is transforming data center connectivity. Built on TSMC’s 3nm technology, it supports high-bandwidth networking across up to 60-mile spans and secures data via hardware encryption. Each system can support up to 4,500 chips—designed to empower hyperscalers like Microsoft and Amazon.
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XConn Debuts PCIe Gen 6.2 / CXL 3.1 Hybrid Switch
At the FMS25 summit, XConn Technologies announced a hybrid PCIe Gen 6.2 and CXL 3.1 switch—the Apollo 2. With Intel and ScaleFlux partnerships, this scalable all-in-one switch is aimed at enhancing AI/data center performance through simplified interconnect design and reduced latency.
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Why It Matters:
As AI models grow in size and complexity, hardware bottlenecks become critical. Jericho4 and Apollo 2 are solving those issues with better architecture, connectivity, and security—triangulating to create faster and more resilient AI infrastructure.
